1～2 item / All 2 items
Compact space-saving tabletop ACF bonding device.
- By specializing in compact circuit boards, it is smaller and lighter compared to conventional devices. - Setup and switching are easy, allowing for support of a wide variety of types and models. - By using the optional adjustable circuit board fixture, easy crimping operations can be immediately performed on circuit boards measuring 90mm x 110mm or smaller.
Customizable to fit your usage needs! Compact, space-saving tabletop ACF bonding device.
The "ACF Bonding Device" is a tabletop device used for thermal bonding of anisotropic conductive films (ACF) for connecting FPC/PCBs in automotive, industrial, and consumer equipment. It specializes in the small-lot production of various small components, making it suitable for development, research, and repair applications. By focusing on small PCBs, it is smaller and lighter compared to general devices. Additionally, by using an optional multi-fixing jig, experimental bonding operations can be immediately executed for PCBs measuring 144mm x 77mm or smaller. 【Features】 - Smaller and lighter compared to general devices by specializing in small PCBs - Capable of accommodating ACF bonding lengths from 14mm to 64mm - The temporary bonding device is equipped with ACF half-cut and automatic feeding mechanisms - Customization options are available to match the workpieces used - Easy setup and switching, making it suitable for small-lot production, development, research, and repair applications *For more details, please refer to the PDF document or feel free to contact us.
